| 摘要 |
PROBLEM TO BE SOLVED: To solve the problem that unreliable airtightness has been induced conventionally in an electronic component storing container comprising its insulation substrate having a cavity and its plate-form metal cap. SOLUTION: The electronic component storing container comprises an insulation substrate 1 having in its top surface a cavity 1a for mounting therein an electronic component 3 and a plate-form metal cap 2 attached to the top surface of the insulation substrate 1 by using a glass sealant 6. The electronic component 3 is stored airtightly in a space between the insulation substrate 1 and cap 2. Also, an active metal brazing material layer 7 containing one or more kinds of titanium, zirconium, and hafnium is formed on the joining surface of the metal cap 2 to the glass sealant 6. Further, the glass sealant 6 is the one wherein a cordierite-based compound of 16-45 mass % is added as a filler to a glass component containing phosphorus pentoxide of 30-40 mass %, tin monoxide of 37-50 mass %, sodium oxide of 5-15 mass %, zinc oxide of 1-6 mass %, aluminum oxide of 1-4 mass %, and silicon oxide of 1-3 mass %. COPYRIGHT: (C)2004,JPO
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