发明名称 HEAT RADIATING MEMBER AND ELECTRONICS APPARATUS
摘要 PROBLEM TO BE SOLVED: To provide a heat radiating member which is easy to handle, whose interfacial heat resistance of a junction surface, when being mounted becomes markedly small, and which superior in heat radiating characteristics, and an electronics apparatus into which it is incorporated. SOLUTION: This is a radiating member, which characteristically has a paraffin wax layer formed at least on the whole or on a part of one surface of a silicon cured material, which is filled with a heat conduction filler. In this case, it is preferable that the paraffin wax layer have a silicon oil of 10 wt.% percentage or smaller (excluding of 0), and/or it has a liquid paraffin, and it does not include a heat conduction filler. It is also preferable that the silicon cured material be a solidified material of a compounding material, which includes an addition reaction fluid silicon and a heat conduction filler, and it is a radiating spacer whose thermal conductivity is 1 W/m×K or larger, and whose Asker C hardness is 40 or less. This is an electronics apparatus, in which the radiating member is incorporated. COPYRIGHT: (C)2004,JPO
申请公布号 JP2003309386(A) 申请公布日期 2003.10.31
申请号 JP20020115991 申请日期 2002.04.18
申请人 DENKI KAGAKU KOGYO KK 发明人 MITSUNAGA TOSHIKATSU;KAWANO MASATO;ITABASHI YASUHIKO
分类号 H05K7/20;H01L23/36;H01L23/373;(IPC1-7):H05K7/20 主分类号 H05K7/20
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