| 摘要 |
PROBLEM TO BE SOLVED: To suppress the peeling of a protective insulating film from an organic siloxane film without raising the specific inductive capacity of the siloxane film. SOLUTION: The peeling of the protective insulating film from the organic siloxane film is suppressed by forming a reformed layer by plasma-treating the surface of the siloxane film with a fluorinecontaining gas and, thereafter, forming the protective insulating film on the reformed layer. Consequently, the peeling of the protective insulating film from the organic siloxane film can be prevented, because the adhesive property between the siloxane film and insulating film can be improved without raising the specific inductive capacity of the siloxane film. COPYRIGHT: (C)2004,JPO
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