| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide conductive adhesive, where electrical resistance is remarkably low and high connection reliability can be obtained, and to provide an electronic component mounting structure. <P>SOLUTION: An electronic component 6 is mounted on a conductor circuit 2, by using a conductive component including a particulate silver compound as a conductive adhesive 5. A reducing agent and a binder can be added to the conductive component. It is desirable to use a mixture made of one or two types selected from silver (I) oxide, silver (II) oxide, silver carbonate, silver acetate and an acetyl-acetone complex as the particulate silver compound, or the conductive component, including particulate silver oxide and tertiary fatty acid silver can be used. <P>COPYRIGHT: (C)2004,JPO |
