| 摘要 |
PROBLEM TO BE SOLVED: To provide a flip-chip semiconductor device which is reduced in cost by reusing a support substrate having high rigidity which is used when forming a multilayer wiring board, and to provide a method of manufacturing the same. SOLUTION: An etch back layer 2 formed of aluminum or copper is formed on a base substrate 1, and then the multilayer wiring board 44 is manufactured on the etch back layer 22. Then, the etch back layer 2 is removed by etching under such a conditions that the multilayer wiring board 44 and the base substrate 1 are not etched, and then the base substrate 1 is separated from the multilayer wiring board 44 while making it possible to reuse the base substrate 1. COPYRIGHT: (C)2004,JPO |
