| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor manufacturing apparatus capable of reducing a product cost based on reduction in a facility cost, by reducing an apparatus cost than before and reducing a footprint. SOLUTION: Only a single standby vacuum chamber 3 is adjoined to the side of a vacuum treatment chamber 2. In the standby vacuum chamber 3, there are provided a carrying arm 5 for carrying a semiconductor wafer 4 and a wafer support mechanism 6 so configured as to support two semiconductor wafers 4 in a double stage manner. COPYRIGHT: (C)2004,JPO |
