SEMICONDUCTOR INSPECTION DEVICE, SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE, INSPECTION METHOD AND MANUFACTURING METHOD

摘要

PROBLEM TO BE SOLVED: To greatly reduce testing cost by collectively testing a plurality of semiconductor integrated circuit devices with a high precision. SOLUTION: A memory test device 1 is provided with a signature 5 as a random number generating circuit. Similarly, a test device DUT is provided with a signature circuit. At a time of testing, a plurality of test devices DUT is connected with an interface circuit 2 of the memory test device 1. A signature value generated by the signature circuit based on a response waveform output from an internal circuit of the test device DUT, and a signature value generated by the signature circuit 5 of the memory device 1 based on an expected value are compared with each other so as to determine capability of the plurality of test devices DUT connected to the interface circuit 2. COPYRIGHT: (C)2004,JPO