| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To eliminate the difficulty of prior art, wherein in a board built-into a capacitor device therein faulty electrical connection occurs. <P>SOLUTION: A multilayer wiring board 11 is adapted, such that a plurality of insulating layers 1 each comprising an organic material are laminated with a wiring conductor 2 formed on the surface of each of these insulating layer 1, and the wiring conductors 2 located above and below, sandwiching the insulating layer 1 therebetween are electrically connected via a straight-through conductor 3 formed through the insulating layer 1, and further, a capacitor device 8 is contained in a hollow section 5 provided on at least one layer of the insulating layers 1. In the multilayer wiring board 11, the insulating layer, through which a through-hole 5a as the hollow section 5 is formed, consists of a covering layer 10 comprising a polyphenylene ether organic substance on upper and lower surfaces of a liquid crystal polymer layer 9, and the total thickness of the covering layer 10 is larger than the thickness of the liquid crystal polymer layer 9. <P>COPYRIGHT: (C)2004,JPO</p> |
