| 摘要 |
PROBLEM TO BE SOLVED: To improve the application accuracy of a solder resist and to secure the strength of a copper lead by preventing an applied solder resist from flowing out of a tape carrier for semiconductor device. SOLUTION: The tape carrier for semiconductor device comprises a wiring pattern 20 including the copper lead 21 formed on an insulation film 10. The solder resist 30 is applied to the pattern 20 except for a terminal area A of the copper lead 21 facing a device hole 12, while this area is plated with tin to form a plated layer 22. Then the pattern 20 is bent or machined by a press to from recesses 27 and 28 or a recess and projection or the like on the copper lead 21 by which the resist 30 is prevented from flowing out, and to stop the applied solder resist 30 from flowing into the device hole 12. COPYRIGHT: (C)2004,JPO
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