| 摘要 |
PROBLEM TO BE SOLVED: To provide a new multi-layer fine wiring structure concerning a manufacturing method of multi-layer wiring in a digital integrated circuit chip for high speed information processing and in a mounting system such as a package, a module and a board for mounting the chip, and to provide its manufacturing method. SOLUTION: An impedance is controlled constant and a line suitable for digital high speed signal transmission can be obtained in a wide frequency band for obtaining the multi-layer fine wiring structure having a transmission line structure such as a strip line, a micro strip line and a coaxial line by using metals such as copper, silver, gold, aluminum, palladium and niobium as a wiring layer by using high resolution photosensitive polyimide as an insulating layer. Via hole processing to the insulating layer is attained by only a lithography process by using the photosensitive polyimide having high resolution characteristics as the insulating layer. A high density structure can be obtained as compared with a conventional multi-layer wiring technology by forming a metal wiring layer with a pattern by a lift-off method, and the process can be simplified remarkably. COPYRIGHT: (C)2004,JPO
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