| 摘要 |
PROBLEM TO BE SOLVED: To provide a structure with which reduction of stray capacitance and strengthening of adhesion to a substrate are compatible with each other. SOLUTION: The width L2 of an outer-layer conductor 13b, which is the lower face of an outer electrode 3b, is larger than the width L1 of the upper face 3c. As a result, the area of the lower face of a main body 2 covered by the outer-layer conductor 13b is larger than the area of the upper face of the main body 2 covered by the outer-layer conductor 13b. Therefore, adhesion to the substrate in the mounting is satisfactory. Since the area of the main body 2 covered by the upper face 3c, which is the opposite side of the contact point between the outer conductor 3 and a coil terminal with respect to the laminated direction of the main body 2, is smaller than the area of the main body 2 covered by the outer-layer conductor 13, and since the upper face 3c and a conductor pattern inside the main body 2 are not overlapped as seen from the laminated direction of the main body 2, the stray capacitance between the upper face 3c and the conductor pattern is reduced. COPYRIGHT: (C)2004,JPO
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