| 发明名称 |
Process for producing semiconductor article |
| 摘要 |
A process for producing a semiconductor article is provided which comprises the steps of bonding a film onto a substrate having a porous semiconductor layer, and separating the film from the substrate at the porous semiconductor layer by applying a force to the film in a peeling direction.
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| 申请公布号 |
US2003203547(A1) |
申请公布日期 |
2003.10.30 |
| 申请号 |
US20030338847 |
申请日期 |
2003.01.09 |
| 申请人 |
SAKAGUCHI KIYOFUMI;YONEHARA TAKAO;NISHIDA SHOJI;YAMAGATA KENJI |
发明人 |
SAKAGUCHI KIYOFUMI;YONEHARA TAKAO;NISHIDA SHOJI;YAMAGATA KENJI |
| 分类号 |
B28D5/00;G02F1/1362;H01L21/18;H01L21/20;H01L21/304;H01L21/66;H01L31/068;H01L31/18;(IPC1-7):H01L21/84;H01L21/00;H01L21/46;H01L21/30 |
主分类号 |
B28D5/00 |
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