| 摘要 |
PURPOSE: A multi-chip package and a method for manufacturing the same are provided to be capable of increasing memory capacity by stacking the same type memory chips and obtaining various functions by using many kinds of memory chips. CONSTITUTION: A multi-chip package(100) is provided with a circuit board(120) for selectively enclosing the multi-chip package and a plurality of semiconductor chips(111,113,112a) installed at the inner portion of the circuit board for electrically connected with each other. At this time, the circuit board includes the first, second, and third region(121,122,123). Preferably, the circuit board further includes a plurality of board pads formed at the inner portion for being electrically connected to the semiconductor chips. |
