发明名称 |
Polishing agent and polishing method |
摘要 |
In order to polish an insulating film, a cerium oxide polishing agent (ceria slurry) is used. The ceria slurry is composed of cerium oxide powder containing Na, Ca, Fe, and Cr concentration of which is less than 10 ppm. Fragile inorganic and organic insulating films formed at relatively low temperatures can be polished without degrading the characteristics of the semiconductor element due to Na diffusion.
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申请公布号 |
US2003203634(A1) |
申请公布日期 |
2003.10.30 |
申请号 |
US20030407214 |
申请日期 |
2003.04.07 |
申请人 |
HOMMA YOSHIO;KUSUKAWA KIKUO;MORIYAMA SHIGEO;NAGASAWA MASAYUKI |
发明人 |
HOMMA YOSHIO;KUSUKAWA KIKUO;MORIYAMA SHIGEO;NAGASAWA MASAYUKI |
分类号 |
C09G1/02;C09K3/14;H01L21/3105;(IPC1-7):H01L21/302;H01L21/461 |
主分类号 |
C09G1/02 |
代理机构 |
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代理人 |
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