发明名称 |
Method for manufacturing wiring circuit boards with bumps and method for forming bumps |
摘要 |
Wiring circuit boards with bumps can be manufactured such that stable bump connections are possible and plating pre-treatments or other difficult operations are rendered unnecessary. By utilizing a technique whereby a bump-formation etching mask 7 is formed on a bump-forming surface 3a of a metal foil 3 which has a thickness that is the sum of the thickness t1 of the wiring circuit 1 and the height t2 of the bumps 2 which are to be formed on the wiring circuit 1 (t1+t2), and then the bumps 2 are formed by half-etching the metal foil 3 to a depth corresponding to the desired bump height t2 from the bump-formation etching mask 7 side, wiring circuit boards with bumps can be manufactured such that stable bump connections are possible and plating pre-treatments or other complex processes are rendered unnecessary.
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申请公布号 |
US2003201242(A1) |
申请公布日期 |
2003.10.30 |
申请号 |
US20030403024 |
申请日期 |
2003.04.01 |
申请人 |
SONY CHEMICALS CORPORATION |
发明人 |
KANEDA YUTAKA;NAITO KEIICHI;SHINOHARA TOSHIHIRO |
分类号 |
H05K3/34;H05K3/06;H05K3/20;H05K3/40;H05K3/46;(IPC1-7):H01B13/00 |
主分类号 |
H05K3/34 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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