发明名称 Atomic layer deposition methods and chemical vapor deposition methods
摘要 The invention includes atomic layer deposition methods and chemical vapor deposition methods. In a particular aspect of the invention, a source of microwave radiation is provided proximate a reaction chamber. At least a fragment of a precursor material is chemisorbed on a substrate within the reaction chamber while not exposing the precursor material to microwave radiation from the source. Excess precursor material is removed from the chamber, and the chemisorbed material is subsequently exposed to microwave radiation from the source within the reaction chamber.
申请公布号 US2003200917(A1) 申请公布日期 2003.10.30
申请号 US20020133947 申请日期 2002.04.25
申请人 VAARTSTRA BRIAN A. 发明人 VAARTSTRA BRIAN A.
分类号 C23C16/44;C23C16/455;C23C16/48;C30B25/10;(IPC1-7):C30B23/00;C30B25/00;C30B28/12;C30B28/14 主分类号 C23C16/44
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