发明名称 Testing circuit and method for MEMS sensor packaged with an integrated circuit
摘要 A MEMS sensor packaged with an integrated circuit includes switches and control circuitry. In a test mode, the control circuitry causes the switches to turn off and on such that the first and second capacitance of the MEMS sensor can be monitored individually. During a normal mode of operation, the switches are maintained such that the MEMS sensor packaged with the integrated circuit operates to produce a filtered and trimmed output reflecting the sensed phenomena.
申请公布号 US2003201777(A1) 申请公布日期 2003.10.30
申请号 US20020133701 申请日期 2002.04.25
申请人 GOGOI BISHNU P.;JO SUNG JIN 发明人 GOGOI BISHNU P.;JO SUNG JIN
分类号 G01D5/24;G01D21/00;G01R31/28;(IPC1-7):G01R31/02;G01R31/327 主分类号 G01D5/24
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