发明名称 |
Testing circuit and method for MEMS sensor packaged with an integrated circuit |
摘要 |
A MEMS sensor packaged with an integrated circuit includes switches and control circuitry. In a test mode, the control circuitry causes the switches to turn off and on such that the first and second capacitance of the MEMS sensor can be monitored individually. During a normal mode of operation, the switches are maintained such that the MEMS sensor packaged with the integrated circuit operates to produce a filtered and trimmed output reflecting the sensed phenomena.
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申请公布号 |
US2003201777(A1) |
申请公布日期 |
2003.10.30 |
申请号 |
US20020133701 |
申请日期 |
2002.04.25 |
申请人 |
GOGOI BISHNU P.;JO SUNG JIN |
发明人 |
GOGOI BISHNU P.;JO SUNG JIN |
分类号 |
G01D5/24;G01D21/00;G01R31/28;(IPC1-7):G01R31/02;G01R31/327 |
主分类号 |
G01D5/24 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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