发明名称 Substrate and method of forming substrate for fluid ejection device
摘要 A method of forming an opening through a substrate having a first side and a second side opposite the first side includes forming spaced etch stops in the first side of the substrate, etching into the substrate from the second side toward the first side to the spaced etch stops, and etching into the substrate between the spaced etch stops from the second side. Etching into the substrate to the spaced etch stops includes forming a first portion of the opening and etching into the substrate between the spaced etch stops includes forming a second portion of the opening.
申请公布号 US2003201245(A1) 申请公布日期 2003.10.30
申请号 US20020135236 申请日期 2002.04.30
申请人 CHEN CHIEN-HUA;SCHULTE DONALD W.;MCMAHON TERRY E. 发明人 CHEN CHIEN-HUA;SCHULTE DONALD W.;MCMAHON TERRY E.
分类号 G11B5/31;(IPC1-7):G11B5/127;G01D15/00 主分类号 G11B5/31
代理机构 代理人
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