| 摘要 |
A method for reducing data storage requirements for defects identified on one or more related semiconductor wafers is described. The method includes: receiving images of one or more related semiconductor wafers; identifying defects on the one or more related semiconductor wafers by comparing the received images with corresponding images of a model semiconductor wafer having an identical integrated circuit design as the one or more related semiconductor wafers; and compressing information of the identified defects for data storage. |
