| 发明名称 |
Method and apparatus for fabricating a device, and the device and an electronic equipment |
| 摘要 |
The invention provides an apparatus for fabricating a device, in which a high operation efficiency is maintained in a drying treatment for a multilayer-interconnection device. The device can also be fabricated inexpensively. An apparatus for fabricating a device has an inkjet unit that can dispose a liquid material on a substrate, and a preparatory dryer to blow a gas heated at a predetermined temperature to the substrate.
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| 申请公布号 |
US2003203643(A1) |
申请公布日期 |
2003.10.30 |
| 申请号 |
US20030382576 |
申请日期 |
2003.03.07 |
| 申请人 |
SEIKO EPSON CORPORATION |
发明人 |
HASEI HIRONORI;HIRAI TOSHIMITSU |
| 分类号 |
H05B33/10;B05C3/08;B05C5/00;B41J2/01;B41J2/14;G09F9/30;H01L21/288;H01L21/31;H01L21/316;H01L21/3205;H01L21/768;H01L21/77;H01L21/84;H01L27/32;H01L51/50;H01L51/56;H05K3/10;(IPC1-7):H01L21/31;H01L21/469 |
主分类号 |
H05B33/10 |
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