发明名称 |
High frequency apparatus for transmitting or processing high frequency signal, and method for manufactruing the high frequency apparatus |
摘要 |
In a high frequency apparatus for transmitting or processing a high frequency signal, a substrate having a recessed portion is formed in a surface of the substrate, a first interconnecting conductor is formed on the substrate including at least the recessed portion of the substrate, and a dielectric support film is formed on the substrate above the recessed portion of the substrate with an air space sandwiched between the dielectric support film and the substrate. A second interconnecting conductor is formed on a part of a surface of the dielectric support film. The high frequency apparatus has a simple structure and a reduced transmission loss and capable of being made by a simple manufacturing process.
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申请公布号 |
US2003201851(A1) |
申请公布日期 |
2003.10.30 |
申请号 |
US20030421780 |
申请日期 |
2003.04.24 |
申请人 |
MITSUBISHI DENKI KABUSHIKI KAISHA |
发明人 |
YOSHIDA YUKIHISA;NISHINO TAMOTSU;SUEHIRO YOSHIYUKI;LEE SANGSEOK;MIYAGUCHI KENICHI;JIAO JIWEI |
分类号 |
H05K1/02;H01F17/00;H01P1/203;H01P3/00;H01P3/08;H01P5/18;H01P11/00;(IPC1-7):H01P3/08 |
主分类号 |
H05K1/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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