发明名称 High frequency apparatus for transmitting or processing high frequency signal, and method for manufactruing the high frequency apparatus
摘要 In a high frequency apparatus for transmitting or processing a high frequency signal, a substrate having a recessed portion is formed in a surface of the substrate, a first interconnecting conductor is formed on the substrate including at least the recessed portion of the substrate, and a dielectric support film is formed on the substrate above the recessed portion of the substrate with an air space sandwiched between the dielectric support film and the substrate. A second interconnecting conductor is formed on a part of a surface of the dielectric support film. The high frequency apparatus has a simple structure and a reduced transmission loss and capable of being made by a simple manufacturing process.
申请公布号 US2003201851(A1) 申请公布日期 2003.10.30
申请号 US20030421780 申请日期 2003.04.24
申请人 MITSUBISHI DENKI KABUSHIKI KAISHA 发明人 YOSHIDA YUKIHISA;NISHINO TAMOTSU;SUEHIRO YOSHIYUKI;LEE SANGSEOK;MIYAGUCHI KENICHI;JIAO JIWEI
分类号 H05K1/02;H01F17/00;H01P1/203;H01P3/00;H01P3/08;H01P5/18;H01P11/00;(IPC1-7):H01P3/08 主分类号 H05K1/02
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