发明名称 |
Semiconductor package with a controlled impedance bus and method of forming same |
摘要 |
An apparatus includes a first substrate having a set of semiconductor devices formed within it. The apparatus also includes a second substrate. A third substrate has a data conductor coupled between first and second connections to the second substrate. The data conductor is coupled to the set of semiconductor devices at respective connection points.
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申请公布号 |
US2003202373(A1) |
申请公布日期 |
2003.10.30 |
申请号 |
US20030410390 |
申请日期 |
2003.04.08 |
申请人 |
RAMBUS INC. |
发明人 |
GAMINI NADER;PERINO DONALD V. |
分类号 |
H01L21/66;H01L23/525;H01L23/538;H01L23/66;H05K1/14;H05K1/18;H05K3/36;(IPC1-7):G11C5/02 |
主分类号 |
H01L21/66 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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