发明名称 |
PACKAGE STACKED SEMICONDUCTOR DEVICE HAVING PIN LINKING MEANS |
摘要 |
A package stacked semiconductor device includes a plurality of pin linking means for electrically connecting at least one of control signal pins of one package to its neighbor NC pin of the same package. Either of the control signal pin or the neighbor NC pin, which are electrically interconnected, is electrically connected to the corresponding pin of the next package.
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申请公布号 |
US2003201529(A1) |
申请公布日期 |
2003.10.30 |
申请号 |
US20020251762 |
申请日期 |
2002.09.23 |
申请人 |
JEONG DO-SOO;CHOI WAN-GYUN |
发明人 |
JEONG DO-SOO;CHOI WAN-GYUN |
分类号 |
H01L23/495;H01L23/50;H01L25/10;(IPC1-7):H01L23/04 |
主分类号 |
H01L23/495 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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