Interstitial material with enhanced thermal conductance for semiconductor device packaging

摘要

A thermal interface material for conducting thermal energy between a first surface and a second surface is disclosed. In an exemplary embodiment, the thermal interface material includes a non-metallic support layer and a phase change material coated on the support layer. At a transition temperature of the phase change material, the phase change material is caused to flow into gaps present between the support layer and the first and second surfaces. In addition, phase change compound (PCC) materials may be formulated to solid phase transition over a desired temperature range, such that in a the solid phase transition mode, a structured cell/laminate may be employed as a thermal energy storage unit which can provide thermal load-damping capabilities due to its latent heat effect.