发明名称 |
Multiple chips bonded to packaging structure with low noise and multiple selectable functions |
摘要 |
A chip package for semiconductor chips is provided by the method of forming a chip package includes the steps of forming a printed circuit board with a window therethrough; forming semiconductor chip connections of one or more primary chips which overlie the window to the printed circuit board by solder connections, locating a suspended semiconductor chip within the window, and connecting the suspended semiconductor chip to one or more primary chips overlying the window in a chip-on-chip connection. A bypass capacitor is formed on the printed circuit board.
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申请公布号 |
US2003201545(A1) |
申请公布日期 |
2003.10.30 |
申请号 |
US20030437333 |
申请日期 |
2003.05.13 |
申请人 |
MEGIC CORPORATION |
发明人 |
LIN MOU-SHIUNG;PENG BRYAN |
分类号 |
H01L25/065;H05K1/00;H05K1/02;H05K1/14;(IPC1-7):H01L23/48 |
主分类号 |
H01L25/065 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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