| 摘要 |
PURPOSE: A method for monitoring particles of semiconductor equipment is provided to be capable of exactly analyzing the shape or component of the particle as well as the number of the particles for improving the producing yield of a semiconductor device. CONSTITUTION: A test wafer with an arbitrary pattern, is manufactured(10). After loading the test wafer into a pre-scan equipment, a pre-scanning process is carried out at the loaded test wafer(20). After loading the test wafer to semiconductor equipment, a depositing process is carried out by using the same process as a real wafer deposition(30). After loading the deposited test wafer at post-scan equipment, a post-scanning process is carried out at the loaded test wafer(40). The shape, component, and number of particles are analyzed by comparing the two results of the pre-scanning and post-scanning process(50).
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