发明名称 |
INTEGRATED CORE MICROELECTRONIC PACKAGE |
摘要 |
<p>A microelectronic package including a microelectronic die disposed within an opening in a microelectronic packaging core, wherein an encapsulation material is disposed within portions of the opening not occupied by the microelectronic die. Build-up layers of dielectric materials and conductive traces are then fabricated on the microelectronic die, the encapsulant material, and the microelectronic package core to form the microelectronic package.</p> |
申请公布号 |
EP1356519(A2) |
申请公布日期 |
2003.10.29 |
申请号 |
EP20010968251 |
申请日期 |
2001.08.29 |
申请人 |
INTEL CORPORATION |
发明人 |
HENAO, MARIA;MU, XIAO-CHUN;MA, QING;VU, QUAT;LI, JIAN |
分类号 |
H01L23/532;H01L21/56;H01L23/00;(IPC1-7):H01L23/538 |
主分类号 |
H01L23/532 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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