Wafer holding plate for wafer grinding apparatus and method for manufacturing the same.

摘要

A wafer holding plate for a wafer grinding apparatus. The plate includes a substrate (B1) having a wafer adhering surface (6a) to which a semiconductor wafer is adhered by an adhesive. The wafer adhering surface includes a mirror-like surface portion and a groove pattern (10), which anchors the adhesive. When the plate is used for grinding wafers, the quality and accuracy of the finished wafers is greatly improved.