| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for manufacturing a copper electrode for solder connecting which has good solder connectability even when the electrode is left to stand for the atmosphere for a while after a plasma treatment is performed and in which reliability is not lowered even after the connection. SOLUTION: The copper electrode 12 is illuminated with hydrogen plasma, and thereby hydrogen is stored in the electrode 12. Thus after the plasma treatment, the hydrogen stored in the electrode is gradually discharged, and reoxidation of the surface of the copper is prevented during this period. Since this oxidation of the surface of the copper is a cause for disturbing the solder connectability, the electrode having good solder connectability is obtained by this manufacturing method. COPYRIGHT: (C)2004,JPO |
