| 发明名称 |
Stress reduction in flip-chip PBGA packaging by utilizing segmented chip carries |
| 摘要 |
A method and structure to electrically couple a semiconductor device to a substrate that is divided into a plurality of segments. Alternatively, a semiconductor device may be divided into a plurality of segments and the plurality of segments are electrically coupled to a single substrate.
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| 申请公布号 |
US6639302(B2) |
申请公布日期 |
2003.10.28 |
| 申请号 |
US20020103602 |
申请日期 |
2002.03.20 |
| 申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
DARBHA KRISHNA;JIMAREZ MIGUEL A.;REISS MATTHEW M.;SATHE SANJEEV B.;WOYCHIK CHARLES G. |
| 分类号 |
H01L23/12;H01L23/498;(IPC1-7):H01L29/06 |
主分类号 |
H01L23/12 |
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