| 摘要 |
Disclosed is a method for fabricating a plate-type magnetic resistance sensor chip simply and easily. First, a characteristic membrane composed of NiCo and NiFe is deposited over a surface of a glass wafer, exposed to light, and etched in a predetermined pattern to establish sensing parts. Then, a protective film is formed atop each of the sensing parts by depositing a SiO2 membrane over the glass wafer, exposing the SiO2 membrane to light, and etching the SiO2 membrane in the same pattern as in the sensing part. The resulting structure is subjected to sand blasting to form through-holes at every corner of the sensing parts. A NiFe film is deposited around the through-holes on both sides of the glass wafer and within the through-holes to form conductors. Finally, the glass wafer is diced into individual rectangular magnetic resistance sensor chips in such a way that each magnetic resistance sensor chip has four arc corners with a NiFe conductor established at every arch corner on both sides of the wafer glass, the NiFe conductor serving as a terminal part.
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