发明名称 |
Memory package with a controller on one side of a printed circuit board and memory on another side of the circuit board |
摘要 |
A memory chip package with a controller die on a first side of a printed circuit board and a memory die on a second side of the same printed circuit board. The memory chip package is integrated into a microprocessor controlled device or alternatively is integrated into a portable memory card.
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申请公布号 |
US6639309(B2) |
申请公布日期 |
2003.10.28 |
申请号 |
US20020112968 |
申请日期 |
2002.03.28 |
申请人 |
SANDISK CORPORATION |
发明人 |
WALLACE ROBERT F. |
分类号 |
G06K19/077;H01L25/065;H01L25/18;(IPC1-7):H01L23/02 |
主分类号 |
G06K19/077 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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