发明名称 Memory package with a controller on one side of a printed circuit board and memory on another side of the circuit board
摘要 A memory chip package with a controller die on a first side of a printed circuit board and a memory die on a second side of the same printed circuit board. The memory chip package is integrated into a microprocessor controlled device or alternatively is integrated into a portable memory card.
申请公布号 US6639309(B2) 申请公布日期 2003.10.28
申请号 US20020112968 申请日期 2002.03.28
申请人 SANDISK CORPORATION 发明人 WALLACE ROBERT F.
分类号 G06K19/077;H01L25/065;H01L25/18;(IPC1-7):H01L23/02 主分类号 G06K19/077
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