发明名称 METHOD OF FORMING COATING FILM
摘要 PROBLEM TO BE SOLVED: To provide a method of forming a coating film by which the coating film free from coating unevenness such as coating stripes or repelling is obtained in a dip coating method of forming the coating film on a material to be coated by suspending the material to be coated in a coating vessel and dipping into a coating liquid filled in the coating vessel. SOLUTION: In the method of forming the coating film by suspending the material to be coated in the coating vessel and dipping into the coating liquid filled in the coating vessel to form the coating film on the material to be coated, the dipping time of the material to be coating into the coating liquid satisfies the following inequality. 3a+b>80 (sec)...(1) In the inequality, (a) is the time required until the material to be coated moves downward up to a prescribed position and stops after the material to be coated is brought into contact with the liquid surface of the coating liquid and (b) is the time while the material to be coated is suspended in the coating liquid. COPYRIGHT: (C)2004,JPO
申请公布号 JP2003305404(A) 申请公布日期 2003.10.28
申请号 JP20020113445 申请日期 2002.04.16
申请人 MITSUBISHI PAPER MILLS LTD 发明人 TANABE KUNIHIRO;KANEDA YASUO
分类号 G03G5/05;B05D1/18;B05D7/00;H05K3/06;(IPC1-7):B05D1/18 主分类号 G03G5/05
代理机构 代理人
主权项
地址