发明名称 |
High power radiation emitter device and heat dissipating package for electronic components |
摘要 |
The electronic component package of the present invention includes a sealed chamber; a liquid or gel contained in the sealed chamber; at least one electronic component disposed in the sealed chamber in physical and thermal contact with the liquid or gel; and at least one electrical conductor electrically coupled to the electronic component and extending out of said sealed chamber. The electronic component(s) may include any one or combination of a radiation emitter, a thermal or optical sensor, a resistor, and a microprocessor or other semiconductor component.
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申请公布号 |
US6639360(B2) |
申请公布日期 |
2003.10.28 |
申请号 |
US20010835238 |
申请日期 |
2001.04.13 |
申请人 |
GENTEX CORPORATION |
发明人 |
ROBERTS JOHN K.;REESE SPENCER D. |
分类号 |
F21S8/10;F21V29/00;F21V29/02;F21W101/10;F21Y101/02;H01L23/02;H01L23/42;H01L33/64;H01L51/52;(IPC1-7):H01J1/62 |
主分类号 |
F21S8/10 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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