| 发明名称 |
High performance packaging platform and method of making same |
| 摘要 |
A packaging platform for interconnecting integrated circuit chips and cards, in which the platform is a circuitized fluoropolymer-based laminate carrier including high purity fluoropolymer protective barriers on its surfaces.
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| 申请公布号 |
US6639155(B1) |
申请公布日期 |
2003.10.28 |
| 申请号 |
US19970872782 |
申请日期 |
1997.06.11 |
| 申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
BUPP JAMES R.;FARQUHAR DONALD S.;JIMAREZ LISA J. |
| 分类号 |
H01L23/498;H05K1/11;H05K3/42;H05K3/46;(IPC1-7):H05K1/16 |
主分类号 |
H01L23/498 |
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