| 发明名称 |
METHOD FOR CONNECTING SUBSTRATES AND COMPOSITE ELEMENT |
| 摘要 |
A process for joining substrates having electrical, semiconducting, mechanical and/or optical components, and to a composite element is provided. The process is to be suitable for substrates that are to be joined substantially irrespective of material and for sensitive substrates. According to the process, a raised frame, in particular formed from anodically bondable glass, is applied by evaporation coating to one of the two substrates in order to serve as a joining element. |
| 申请公布号 |
AU2003227626(A1) |
申请公布日期 |
2003.10.27 |
| 申请号 |
AU20030227626 |
申请日期 |
2003.04.15 |
| 申请人 |
CARL-ZEISS-STIFTUNG TRADING AS SCHOTT GLAS |
发明人 |
DIETRICH MUND;JURGEN LEIB |
| 分类号 |
G02B3/00;B81C1/00;B81C3/00;C03B19/00;C03C4/12;C03C14/00;C03C15/00;C03C17/02;C03C17/34;C03C27/02;C23C14/10;H01L21/027;H01L21/306;H01L21/3065;H01L21/312;H01L21/316;H01L21/50;H01L21/56;H01L21/768;H01L23/00;H01L23/02;H01L23/10;H01L23/29;H01L23/31;H01L23/48;H01L23/498;H01L51/50;H01L51/52;H05B33/04;H05B33/10;H05B33/24;H05B33/26;H05B33/28;H05K3/28 |
主分类号 |
G02B3/00 |
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