| 摘要 |
PROBLEM TO BE SOLVED: To achieve extending the life of a filament, stabilizing an electron emitting capacity, further improving quality and reliability of an oxide film formed by a vapor deposition process with the use of such a filament, saving time and labor for the vapor deposition process, and reducing the cost. SOLUTION: This vapor deposition method is characterized by controlling each of a temperature of the filament 20 and a partial pressure of oxygen around the filament, while keeping a condition of the combination of them so as not to oxidize tungsten or a material reactive with oxygen, which is a forming material of the filament 20, and raising or lowering each the temperature and the partial pressure of oxygen, to cancel or reduce thermal oxidation of the filament 20. COPYRIGHT: (C)2004,JPO
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