| 摘要 |
PROBLEM TO BE SOLVED: To provide a manufacturing device for a semiconductor device having a cutting punch, without rubbing with a solder plating on the cut lead side surface against each other, or without peeling off the solder plating. SOLUTION: A cutting punch 10, cutting the outside lead 21 of the horizontally mounted semiconductor device by descending vertically, is constituted of an upper part connected to a top force, a punching part constituting an edge for cutting an outside lead and an intermediate part between the upper part and the punching part. The side surface 13 of the intermediate part is provided with a slanted side surface 13, slanted inwardly gently from the vertical side surface 12 of the punching part to the upper part. COPYRIGHT: (C)2004,JPO
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