| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a wafer alignment mark for image-processing alignment that improves deterioration in alignment accuracy caused by processes without increasing the occupation area of the alignment mark, can greatly improve overlapping accuracy, and further can increase throughput, and to provide an image-processing alignment method and a manufacturing method of a semiconductor device. <P>SOLUTION: A plurality of rectangular patterns 1a are aligned within an imaging screen, and frame width and size of respective rectangle patterns 1a are changed for forming the alignment mark 1. Then, the signal waveform of each rectangular pattern 1a is measured, the number of the rectangle patterns that can obtain normal waveforms is compared with the minimum number of predetermined required marks, and abnormal measurement results are excluded, thus calculating the amount of deviation in alignment. As a result, the alignment can be made surely even if failures occur in some of the rectangular patterns. <P>COPYRIGHT: (C)2004,JPO</p> |
