| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor chip bonding head which is excellent in a cooling effect and an operation time can be shortened. SOLUTION: The semiconductor chip bonding head is equipped with a head body 12, a heater plate 13 attached to the head body 12, a suction tool 15 which has a suction hole 14 and is abutted against an underside of the heater plate 13, and a cooling portion. The cooling portion includes a cooling-air feeding channel 16 penetrating the head body 12 and the heater plate 13; and a cooling- air passage path 23 for cooling the suction tool 15 and the heater plate 13, which is formed on the upper side of the suction tool 15 and opened in the sidewall of the suction tool 15, and is communicated with the cooling-air feeding channel 16. COPYRIGHT: (C)2004,JPO
|
