| 摘要 |
PROBLEM TO BE SOLVED: To provide a chip mounting method and an apparatus thereof wherein to repair of a defective substrate is easier at higher reliability in jointing, compared to a conventional method in which an adhesive solidifies when a chip is jointed to a substrate. SOLUTION: Immediately after a prescribed electrode section of a substrate 1 is cleaned with plasma, the electrode section is applied with an adhesive, and then it is carried to an ultrasonic jointing unit 250. A chip 2 is placed on the electrode section of the substrate 1 by an ultrasonic head 252. The abutting parts of both electrodes of the substrate 1 and the chip 2 are applied with ultrasonic vibration so that the chip 2 is jointed to the substrate 1. The substrate 1 to which the chip 2 is jointed is inspected in a function inspecting process. The chip 2 of a defective substrate is removed and replaced in a repair process. The adhesive only on a sound substrate 1 is allowed to solidify at an adhesive solidifying unit so that the chip 2 is tightly fitted to the substrate 1. COPYRIGHT: (C)2004,JPO
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