| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a manufacturing method for surface-mounted optical semiconductor devices, which relaxes requirements for process accuracy in splitting a substrate to improve production efficiency of the optical semiconductor devices. <P>SOLUTION: Elongated through-holes for electrical connection are formed on the substrate, wiring patterns are formed on the front surface and the back surface of the substrate, respectively, and the front and back wiring patterns are electrically connected via the elongated through-holes. Optical semiconductor elements are mounted on the front surface of the substrate and are electrically connected to the wiring patterns. The substrate front surface other than the elongated through-holes and the elements are covered with a translucent resin. Then the substrate is divided so as to cross the minor axis direction of the elongated through-holes. <P>COPYRIGHT: (C)2004,JPO |
