| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method and a system for packaging a component efficiently by eliminating useless measurements and inspections. <P>SOLUTION: Bend and float of leads are measured, respectively, by a 2D sensor 8 and a 3D sensor 10 and only a component having no bending or floating lead is mounted on a substrate 9. Measurement is started from the 3D sensor (A) when the measuring time of the 3D sensor is shorter than that of the 2D sensor, and measurement is started from the 2D sensor in reverse case (B). Since the measurement judged to have a shorter measuring time is performed first, such components as will be rejected by the inspection based on the measurement of shorter measuring time are not measured uselessly and the component can be inspected and mounted through efficient operation. <P>COPYRIGHT: (C)2004,JPO |
