| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a photosensitive transfer material which produces a suppressed quantity of chips during being cut in a working step. <P>SOLUTION: In the photosensitive transfer material having a thermoplastic resin layer, an alkali-soluble intermediate layer and an alkali-soluble pigment- containing photosensitive resin layer in this order on a temporary support, the ratio (Em/Ep) of the elastic modulus Em of the intermediate layer to the elastic modulus Ep of the thermoplastic resin layer is in the range of 0.8-2.0. <P>COPYRIGHT: (C)2004,JPO</p> |
