| 摘要 |
PROBLEM TO BE SOLVED: To provide an insulation circuit board, having a small heat resistance and high reliability, and a semiconductor device employing the board. SOLUTION: The insulation circuit board is obtained, by laminating a first metal plate and a second metal plate or a conductive metal plate formed on the first metal plate through two layers of resin insulation layers so as to have the shape of an electric circuit pattern. A first resin layer, contacted with the first metal base board, is a resin layer, filled with 50 wt.% or more of filler having a thermal conductivity of 20 W/m K or higher and having a thickness, larger than 20μm; while the filling rate of the filler of the second resin layer contacted with the second metal plate is smaller than the filling rate of filler of the first resin layer, and the thickness of the same is smaller than 5μm. COPYRIGHT: (C)2004,JPO |
