PATTERN MEASURING METHOD, PATTERN MEASURING DEVICE AND PATTERN PROCESS CONTROL METHOD

摘要

PROBLEM TO BE SOLVED: To provide a pattern measurement technology for non-destructively, accurately and quantitatively measuring the sectional shape of any type of patterns from normal tapers to reverse tapers. SOLUTION: Distribution of reflection electron or secondary electron intensity is processed from a control system of a scan type microscope and an adjacent terminal, and the shape of an area representing the edge vicinity is digitized to calculate a taper gradient from the result. From the image data of a sky photograph obtained by the scan type microscope, the shape of the area in the vicinity of the pattern edge is digitized to evaluate the taper gradient of the sectional shape. Only from the sky observation result, the gradient of an edge such as reverse taper, vertical and normal tape can be evaluated. COPYRIGHT: (C)2004,JPO