| 摘要 |
PROBLEM TO BE SOLVED: To provide a wiring board which is capable of preventing cracks from occurring in a boundary between the via conductor body and the periphery of a via conductor, even when the center axes of a viahole and a through-hole are set coincident with each other and the through-hole is set small in inner diameter. SOLUTION: The wiring board 100 is equipped with the through-hole 111, the first viahole 121, and the second viahole 131. Their center axes are coincident with each other. The inner diameter D1 of the through-hole 111 is set at 200μm or below, and a first resin insulating layer 120 and a second resin insulating layer 130 each have a thermal expansion coefficient of 60 ppm or below. COPYRIGHT: (C)2004,JPO
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