| 摘要 |
PROBLEM TO BE SOLVED: To provide an electronic apparatus which can be easily downsized and is suppressed in the occurrence of the disconnection of the wiring layer that a flexible substrate has. SOLUTION: The electronic apparatus has a glass substrate 10 having the wiring layer 12 formed on one surface 10a and the flexible substrate 20 having the wiring layer 22 formed on one surface 20a. The glass substrate 10 and the flexible substrate 20 are so arranged that the end of the surface 10a formed with the wiring layer 12 and the end of the substrate 20a formed with the wiring layer 22 are superposed on each other. The wiring layer 12 and the wiring layer 22 are electrically connected to each other by an ACF 30 disposed between the ends. An insulating film 40 is formed in a region including a region facing the end side of the glass substrate 10 of the surface 20a formed with the wiring layer 22 of the flexible substrate 20. COPYRIGHT: (C)2004,JPO
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