发明名称 |
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF |
摘要 |
PROBLEM TO BE SOLVED: To form a barrier layer that sufficiently withstands etching as an etching stopper to protect a semiconductor film from the etching, enables impurities to move in an oxide film in heat treatment for gettering, and has satisfactory reproducibility, and to use the barrier layer for carrying out the gettering of the impurities contained in the semiconductor film. SOLUTION: The barrier layer is a silicon oxide film. The ratio of suboxide contained in the barrier layer is set to at least 18%. COPYRIGHT: (C)2004,JPO |
申请公布号 |
JP2003303770(A) |
申请公布日期 |
2003.10.24 |
申请号 |
JP20020109305 |
申请日期 |
2002.04.11 |
申请人 |
SEMICONDUCTOR ENERGY LAB CO LTD;SHARP CORP |
发明人 |
NAKAZAWA MISAKO;ICHIJO MITSUHIRO;HAMAYA TOSHIJI;ONUMA HIDETO;MAKITA NAOKI |
分类号 |
H01L21/20;H01L21/322;H01L21/336;H01L21/77;H01L21/84;H01L27/12;H01L29/423;H01L29/49;H01L29/786;(IPC1-7):H01L21/20 |
主分类号 |
H01L21/20 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|