发明名称 SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
摘要 PROBLEM TO BE SOLVED: To form a barrier layer that sufficiently withstands etching as an etching stopper to protect a semiconductor film from the etching, enables impurities to move in an oxide film in heat treatment for gettering, and has satisfactory reproducibility, and to use the barrier layer for carrying out the gettering of the impurities contained in the semiconductor film. SOLUTION: The barrier layer is a silicon oxide film. The ratio of suboxide contained in the barrier layer is set to at least 18%. COPYRIGHT: (C)2004,JPO
申请公布号 JP2003303770(A) 申请公布日期 2003.10.24
申请号 JP20020109305 申请日期 2002.04.11
申请人 SEMICONDUCTOR ENERGY LAB CO LTD;SHARP CORP 发明人 NAKAZAWA MISAKO;ICHIJO MITSUHIRO;HAMAYA TOSHIJI;ONUMA HIDETO;MAKITA NAOKI
分类号 H01L21/20;H01L21/322;H01L21/336;H01L21/77;H01L21/84;H01L27/12;H01L29/423;H01L29/49;H01L29/786;(IPC1-7):H01L21/20 主分类号 H01L21/20
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