| 摘要 |
PROBLEM TO BE SOLVED: To solve the problem that the temperature of an electrilytic capacitor rises due to heat generated at a power pressure-welding semiconductor element, to shorten a life, related to a power pressure-welding semiconductor device in which the power pressure-welding semiconductor element is mounted on a printed board with the electrolytic capacitor mounted close to it. SOLUTION: A heat sink whose cross section is L-shaped or U-shaped is mounted on a part of the side on which the electrolytic capacitor is fitted which is close to a fitting point of the electrolytic capacitor to contact a printed board. The contact area between the heat sink and the printed board is preferred to be larger. COPYRIGHT: (C)2004,JPO
|
